CSP及其基板技术
CSP and it's Substrate Technology
摘要
本文首先介绍了CSP的发展过程、常见CSP的种类以及CSP对基板的技术要求,并在此基础上对CSP基板技术作了分类介绍。文中涉及的CSP基板技术包括设计、图象转移、基材、铜箔、微孔互连、表面涂层、AOI、电测试等。
出处
《印制电路信息》
2001年第6期38-41,共4页
Printed Circuit Information
参考文献8
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