摘要
Polycrystalline and epitaxial CoSi 2 films are formed on the n-Si (111) substrates by solid state reaction of the as-deposited Co single-layer and Co/Ti bilayer with Si,respectively at different annealing phase.The CoSi 2/Si Schottky contacts are measured with the current-voltage and capacitance-voltage (I-V/C-V) techniques within the range of temperature from 90K to room temperature.The measured I-V characteristics have been analyzed with a model based on the inhomogeneity in Schottky barrier height,i.e.,at high temperatures (≥～200K) or low temperatures but with a large bias,the I-V curves can be described by using the thermionic emission theory with a Gaussian distributed barrier height over the whole junction,while at low temperatures and with a small bias,the current is dominated by some small patches with low barrier height.It results in a plateau-like section in the low temperature I-V curves around 10 -7 A.At room temperature,the barrier height of polycrystalline CoSi 2/Si deduced from the I-V curve is about 0 57eV.For epitaxial CoSi 2,the barrier height depends on its final annealing temperature and increases from 0 54eV to 0 60eV with the annealing temperature increasing from 700℃ to 900℃.
通过硅 (111)衬底淀积的单层 Co或 Co/ Ti双金属层在不同退火温度的固相反应 ,在硅上形成制备了多晶和外延 Co Si2 薄膜 .用电流 -电压和电容 -电压 (I- V/ C- V)技术在 90 K到室温的温度范围内测量了 Co Si2 / Si肖特基接触特性。用肖特基势垒不均匀模型分析了所测得的 I- V特性 ,在较高温度下 (≥～ 2 0 0 K)或较低温度的较大偏压区域 ,I- V曲线能用热激发和在整个结面积上势垒高度的高斯分布模型描述 .而在较低温度的较小偏压区域 ,电流由流过一些小势垒高度微区的电流决定 ,从而在低温 I- V曲线上在约 10 - 7A处有一个“曲折”.在室温下 ,从 I-V曲线得到的多晶 Co Si2 / Si的势垒高度为约 0 .5 7e V.对外延 Co Si2 ,势垒高度依赖于最后退火温度 ,当退火温度从 70 0℃升到 90 0℃ ,势垒高度从 0 .5 4e V升高到 0 .6 0 e V.
基金
中 -比双边合作和上海市科委资助&&
