小型平板热管传热实验研究

Experimental Investigation on Heat Transfer of Miniature Flat Plate Heat Pipes

研究用于电子器件高效冷却的小型平板热管 (简称为热板 )的传热机理 ,提出热板设计方案 ;采用粉末冶金的方法在热板蒸发端烧结毛细多孔层 ,强化了工质的沸腾换热过程 ;对热板进行了传热稳态和瞬态性能测试 ,分析工质充装量、毛细多孔层厚度。

This paper develops a flat plate heat pipe for cooling electronic component of high power. A layer of sintered porous media is applied to the evaporation surface of the FPHP to enhance the heat transfer during the boiling of the working fluid. The transient and steady temperature distribution of the FPHP is measured, the effects of several factors,such as the working fluid filling rate, porous layer filling rate on the performance of the FPHP,are analyzed.