摘要
采用小孔、细线及多重埋孔方式 ,研制出高密度及高特性阻抗印制电路板 ,其孔径、线宽 /线间距以及厚径比分别为 8mil、 3 mil和 1 5:1 ,其综合性能达到和超过国家军标 GJB3 6 2之有关条款要求。
Technologies of small hole,fine line and multi buried via are used to manufacture high performance PCBs whose hole diameter,line width/spacing and aspect ration respectively approach 8mil,3mil/3mil and 15∶1.The comprehensive specifications completely meet or exceed the requirements of certain items of the National Military Standard GJB 362.
出处
《计算机工程与科学》
CSCD
2001年第4期49-51,60,共4页
Computer Engineering & Science
