摘要
采用新材料及多重埋孔方式 ,研制出高密度及高可靠性印制电路板 (PCB) ,其孔径、线宽 /线间距以及厚径比分别为 0 .2mm、0 .0 8mm/0 .0 8mm和 1 5∶1。
New material and multi-buried via technologies are used to manufacture high performance PCBs whose hole diameter,line width/spacing and aspect ratio respectively approach 0.2 mm,0.08 mm/0.08 mm and 15:1.The comprehensive specifications completely meet or exceed the requirements of certain items of the National Military Standard GJB 362.
出处
《电子工艺技术》
2001年第3期116-119,共4页
Electronics Process Technology
