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SIMOX材料顶层硅膜中残余氧的行为 被引量:1

Behavior of Residual Oxygen in Top Si Layer o f SIMOX Studied by PL and SIMS
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摘要 利用光致发光谱 (PL)和二次离子质谱 (SIMS)检测了不同退火条件下处理的 SIMOX材料的顶层硅膜 .实验结果显示 ,SIMOX顶层硅膜的 PL 谱有三个峰 :它们是能量为 1.10 e V的 a峰、能量为 0 .77e V的 b峰和能量为0 .75 e V的 c峰 .与 RBS谱相比 ,发现 a峰峰高及 b/ a峰值比是衡量顶层硅膜单晶完整性的标度 .谱峰 b起源于SIMOX材料顶层硅膜中残余氧 ,起施主作用 .SIMS测试结果显示 ,谱峰 c来源于 SIMOX材料顶层硅膜中的碳和氮 . The crystallization of the top Si layer in SIMOX,especia ll y the behavior of residual oxygen in the top Si layer,is investigated by means o f PL and SIMS,with the sample of P type(100) Si.The results show that there are three peaks in the PL,they are: a peak located at 1 10eV , b peak located at 0 77eV and c peak located at 0 75eV.Comparing with RBS measurement re sults,it is found that the amplitude of the intrinsic peak a in PL and the a mplitude ratio of b peak to a peak are the estimation of crystal perfect ion of the top Si layer of SIMOX wafer.The SIMS results show that the amplitude of b peak is affected by the amount of residual oxygen in the top Si layer of a sample.Peak b is assumed to or iginate from the implantation of oxygen ions and high temperature annealing of S IMOX wafer,which is similar to the phosphorus donor level and plays an important role in making N-type to Si layer of SIMOX from P-type substrate. Meanwhile t he amplitude of c peak depends on the content of nitrogen and carbon in the top Si layer of SIMOX wafer.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2001年第8期1007-1010,共4页 半导体学报(英文版)
基金 高等学校重点实验室访问学者基金资助
关键词 光致发光谱 残余氧 SIMOX材料 顶层硅膜 PL SIMOX SOI SIMS residual oxygen
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参考文献2

  • 1Luo Y,北京师范大学学报,1998年,34卷,1期,68—71页
  • 2Kang H S,Electrochem Soc Proc,1997年,23卷,155页

同被引文献4

  • 1Izumi K,Doken M,Ariyoshi H. CMOS devices fabricated on buried SiO2 layers formed by oxygen implantation into silicon. Electron Lett, 1978,14:593.
  • 2Colinge J P. Silion-on-insulator technology. Kluwer Academic Pub,Boston, 1991.
  • 3SIMOX-SOI Manufacturing, August 1,2001, www. ibs. com.
  • 4Moriceau H,Aspar B,Bruel M,et al. A new characterization process used to qualify SOI films. Electrochemical Society Proceeding99,1999:173.

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