引线框架电镀层测定方法的选择

How to Select Measuring Ways of Lead Frame Plating Layer

引线框架电镀层的质量直接影响着钽电容器的可焊性 ,所以引线框架电镀层质量的测定方法至关重要。通过对比试验认为对框架切片后使用电子探针仪探测和拍照的测定方法能够全面准确地测定出引线框架镀层的质量。

The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. The comparison experiments showed that the quality of the plating layer can be measured exactly by detecting and taking picture of the lead frame cutting sample