负偏压在电弧离子镀沉积TiN/TiCN多层薄膜中的作用

Effect of Negative Bias on Deposition of TiN/TiCN Multilayer Films by Arc Ion Plating

用电弧离子镀方法在高速钢、不锈钢与铜基体上沉积合成TiN/TiCN多层薄膜 ,在其他参数不变的情况下只改变负偏压 ,着重考察不同负偏压下薄膜的沉积温度、膜基结合强度、显微硬度以及表面形貌等 ,研究基体负偏压在沉积多层薄膜中所起的作用。结果表明 ,负偏压影响沉积温度 ,负偏压值越大 ,温度越高 ;负偏压值增大 ,表面形貌中的大颗粒数量减少 ,薄膜质量得到改善 ;负偏压在 - 30 0V左右时 ,膜基结合强度与硬度出现对应最佳性能点的峰值。

TiN/TiCN multilayer films have been deposited on HSS, SS and Cu substrates by arc ion plating (AIP) at different biases with other parameters kept constants. In order to analyze the effect of the negative bias on the adhesions strength between multilayer and substrate, and the hardness of the multilayer have been tested and the morphology has also been observed. The results show that negative biases determine the deposition temperature, the lower the negative bias, the higher the deposition temperature, the better the morphology with less big particles. When the negative bias is around - 300V the film has a optimal adhesion strength and hardness.