摘要
采用扫描电子显微镜、电子探针等分析无铅建筑铝搪瓷界面的显微结构和元素分布 ,并结合铝搪瓷的密着强度 ,探讨了无铅建筑铝搪瓷的密着机理。结果表明 ,密着性能优良的无铅建筑铝搪瓷界面存在铝元素与瓷釉元素相互扩散的中间过渡层 ;中间过渡层与金属铝的结合主要通过金属键来实现 。
The microstructure and element distribution at the interface between aluminium and non-lead enamel have been investigated by scanning electron microscope and electron microprobe, together with analysis of adherence strength of aluminium enamel.The adherence mechanism of non-lead aluminium enamel has been studied. The results show that there is an interlayer, which is developed at the interface due to the interdiffusion of aluminium element and enamel elements . The cohesion between aluminium and the interlayer is resulted from the metallic bond and the cohesion between the enamel and the interlayer is brought about by the ionic bond and covalent bond.
出处
《玻璃与搪瓷》
CAS
北大核心
2001年第3期13-15,37,共4页
Glass & Enamel
关键词
铝搪瓷
密着机理
无铅
低温釉
建筑搪瓷
Aluminium enamel
Adherence
Non-lead oxide
Low temperature enamel