摘要
本文介绍了国内外高频电路用覆铜板的技术进展 ,着重研究了一种环氧改性异氰酸酯类粘合剂 ,结果表明采用该粘合剂 /E型玻璃纤维布制备的层压板产品具有成本低。
This paper introduces technical progress in high frequency copper clad used in circuit at home & aboard ,mainly studies the adhesive of isocyanate modified with epoxy resin.The results of the research show that laminates made of the adhesive and E glass fiber cloth have advantages of low cost and good dielectric property.
出处
《玻璃钢／复合材料》
CAS
CSCD
2001年第3期42-45,共4页
Fiber Reinforced Plastics/Composites
关键词
高频电路
环氧改性异氰酸酯
覆铜板
粘合剂
high frequency circuit isocyanate modified with epoxy resin copper clad
