摘要
本文研究了甲基四氢苯酐中温固化低粘环氧树脂TDE - 85的基本配方和固化条件 ,并着重研究了适用于该体系的促进剂 ,发现促进剂D(金属有机络合物 )对该体系有较好的适用性 ,使其具有较长的使用期 (室温 >2 0天 )和较高的中温固化活性 ,固化物具有良好的耐热性。
The accelerator for the moderate temperature curing system of methyltetrahydrophthalic anhydride/TDE-85 was studied,and the basic formula and curing conditions were discussed.It was found that the system catalyzed by accelerator D(metal organic chelate)had a long pot life and high curing activity and the cured product showed good heat resistance.This system could be used in prepregging,filament winding and resin transfer molding(RTM).
出处
《化学与粘合》
CAS
2001年第4期160-161,167,共3页
Chemistry and Adhesion
