摘要
随着微电子技术的发展 ,印制电路板的组装密度不断提高 ,人们越来越重视焊点工作的可靠性。在分析焊点失效原因的基础上 ,论述了改善焊点可靠性的途径。同时 ,随着人们对环保要求的提高 ,积极开发和推广使用无铅钎料及免清洗钎剂也是当务之急。结合我们的研究成果 ,详细介绍了无铅钎料开发的现状及前景。
Along with the development of microelectronic technology,assembly density of printed circuit plate has been uninterruptedly increased.Thus,ones pay more attention to the working reliability of soldered points.Based on the analysis of failure of soldered points, the ways of improving the reliability of soldered points are discussed in the present paper.At the same time in demand of environmental protection,it is urgent to actively develop and use lead-free solder and no-clean flux.In combination of our recent results,the current status and prospect on lead-free solders has been introduced in detail.
出处
《电子工艺技术》
2001年第4期139-143,共5页
Electronics Process Technology
基金
北京市自然科学基金 (No .2 992 0 0 5 )
