利用金刚石微颗粒进行微米级加工的研究

ULTRA-SMALL SCALE GRINDING WITH DIAMOND ELECTRIC PLATING TOOL (HELICAL-FEED DRILLING MECHANICAL GRINDING METHOD)

为确立用金刚石微颗粒对硬脆性材料进行微加工的技术基础 ,在进行了螺旋切入方式的运动学和力学模式的解析后 ,对用金刚石微颗粒进行磨削微加工的最佳条件进行了探讨。在此基础之上 ,用电镀有金刚石微颗粒的工具和螺旋切入磨削方式 ,成功地实现了对玻璃、硅片等各种各样的硬脆性材料的 1 0

For establishing the basic technology of micro-manufacture with diamond grains on hard and brittle materials, this paper studied the optimization condition of the ultra-small scale grinding with diamond electric plating tool through analyzing the kinematics and mechanics model of the helical-feed drilling mechanical grinding method. Following the analyzes, the author successfully realized the high precision micro-manufacture with the diamond electric plating tool and the helical-feed drilling mechanical grinding method on glasses, silicon and so on.