摘要
陶瓷的原子结构为强共价键或离子键结合 ,钎料难以对其表面润湿。提出了在辉光放电中使活化金属元素通过气相沉积和离子渗入在陶瓷表面形成镀层并使钎料活化 ,从而改善钎料对陶瓷表面的润湿条件。与传统的锰 -钼法和活性金属钎焊法相比 ,这一新方法工艺过程简单 ,生产率高 ,生产成本低 ,值得推广应用。
The atoms of ceramic are connected by covalent or ionic bond, as a result it is difficult for filler metal to wet the ceramic surface This paper points out that by means of spattering deposition and ion permeating in glow discharge,the ceramic surface is plated and the filler metal is activated by active metal elements, thus the wettability of filler metal to ceramic is effectively improved The new technique has advantages over traditional Mn Mo process and active metal brazing process in simplifying the operating process, cutting short the production time, needing not the special filler metal and the equipment with high vacuum
出处
《山西机械》
2001年第4期16-17,19,共3页
Shaanxi Machinery