双材料高聚物界面断裂行为的实验研究

DETERMINATION OF STRESS FIELDS AROUND THE INTERFACE CRACK TIP OF BIMATERIAL USING DICM

将数字相关图象测量方法和显微技术结合起来 ,实现了物体表面位移和应变的细观测量。应用这一方法 ,对双材料高聚物界面断裂行为进行了实验研究 ,定量测量了具有界面裂纹受剪切载荷作用的双材料试件的裂尖附近微小区域内的位移和应变。最后对实验结果进行了分析和讨论 。

Both highly sensitive digital image correlation method (DICM) and microscopy technique are combined to measure displacement and strain fields in minor region on body surface. This method is used to investigate the fracture behavior of PP/CPE composites of four point shearing beam of bimaterial with edge crack in the interface. Bimaterical beam is composed of PP/CPE and epoxy. The displacement and strain field ahead of the crack tip is determined. Some distribution laws of stress field ahead of the crack tip of bimaterial are obtained. The experimental results have been analyzed and discussed in this paper. It is known that the bimaterial interface crack problem is provided with the characteristic of mixed mode crack.