摘要
采用具有蠕变和塑性边界的粘塑性本构方程对Sn Pb共晶合金的基本力学行为进行了模拟和预测。结果表明 :在较宽的外部变量范围 (应变率为 1 0 -5 ～ 1 0 -2 S-1,温度为 - 55～ 1 2 5℃ )内 ,模拟结果与实验结果吻合良好。证明了该方程用于描述Sn
Viscoplastic constitutive equation with creep and plasticity bounds was used to simulate and predict the basic mechanical behaviors of Sn60Pb40 solder alloy. Th e results showed that within a broad range of external variable with temperature varying from -55℃ to 125℃ and the strain rate from 10 -5S -1 to 10 -2S -1, the computed results were in agreement with the experim ental data. The equation provides reliable assurance for predicting the life of SMT solder joints.
出处
《应用力学学报》
CAS
CSCD
北大核心
2001年第3期130-133,共4页
Chinese Journal of Applied Mechanics
