塑料(ABS)表面直接电镀工艺研究

Direct Electroplating of Plastics

研究了以吡咯为单体，FeCl_3为主要氧化剂和掺杂剂，通过氧化聚合的方法在塑料(ABS)表 面形成导电聚合物膜──聚吡咯，然后进行直接电镀的工艺。直接电镀工艺主要包括预处理 、聚吡咯膜的形成和酸性硫酸铜电镀3个阶段。分析了各工艺参数对镀层的影响和镀层的沉 积过程，指出FeCl_3可显著提高聚吡咯的导电性；聚吡咯层表面直接电镀时，镀层的生长 是枝状结晶的过程。

The direct copper electroplating of ABS plastics was made possible by forming an electro-conductive polymer film, polypyrrole, on the plastic surface, and then electroplated in CuSO4 solution. Pyrrole was used as monomer and FeCl3 as oxidizing agent. It was shown that FeCl3 could obviously increase the conductivity of polypyrrole.