提高硅光电探测器树脂封装可靠性研究

Enhancement of Resin Package Reliability on Silicon Photodetector

树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。但它的可靠性,特别是抗潮湿性差。本文通过抗潮湿性能分析,比较了几种树脂封装,发现用FS203C+GN522封装可提高其可靠性。

Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature. Yet, its reliability and anti-moisture permeability, in particular, is far from adequate. This paper has made a careful study of the ability to anti-moisture permeability by comparing quite a few methods of resin package, we have come to the conclusion that the use of FS203C+GN522 can enhance the reliability.