酸性镀铜添加剂及其工艺的发展回顾

Review on Development of the Additives and Technology of Acid Copper Plating

酸性镀铜作为一种装饰性电镀工艺早已被广泛使用 ,其镀层光亮、韧性好、强度高 ,其体系易于实现工业控制。酸性镀铜添加剂经过了长期的发展与完善 ,已形成成熟的体系 ,主要包括整平剂、延展剂、表面活性剂、光亮剂等。

Electroplated copper from acid sulfate-based plating solutions has long term and widely used as engineering or decorative finish, and an undercoat for other plated metals. These acidic copper plating solutions are used to plate on variety of base materials, especially for printed circuit boards. The properties of electroplated copper deposits which are of interest for various applications include brightness, ductility and hardness, furthermore, it is easily to industrial control. Acidic copper plating additives has been developed in long term and has been established. The additives include levelers, ductilzer, surface-active agents and brighteners. This paper will discuss the development about the additives and it's of acidic copper plating solution.