扩散连接界面物理接触行为的动态模型

Dynamic Model of Interfacial Physical Contact in Diffusion Bonding with Interlayer

通过把连接初期可能存在的不影响连接进程的空洞排除掉 ,并把中间层与屈服极限较小的母材一体化 ,提出了既能真实反映实际表面几何形状及连接时表面间的接触几何特性 ,又能简化紧密接触与接合面积数学处理过程的扩散连接接头接触界面几何模型。分析了扩散连接过程的重要阶段 -物理接触阶段 ,并建立了相应的接合面积计算模型 ,利用此模型可以很好地解释扩散连接接头界面不同区域接合强度不同的现象。模型显示 ,在扩散连接的物理接触过程中 ,不同区域的接合能力不同 。

Through eliminating voids that did not affect the primary bonding process,and incorporating interlayer and flexible base material,the interface geometry model of physical contact with real geometry character and brief mathematics process was put forth.Through analyzing contact process of diffusion bonding,contact area model was settled.It can interpret the phenomenon of different interface areas taking on different strengths.In the course of physical contact,shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.