PGA370高密度陶瓷封装局部镀金

The selective gold plating for PGA370 high density ceramic packages

研究了在陶瓷PGA 370和RP 54等具有分离 (导体 )结构的金属导体和引脚的高密度封装的局部镀金技术。结果表明 :采用分步化学镀和电镀相结合的方法 ,适当控制化学镀和电镀工艺条件 ,可以成功地实现上述封装的局部镀金。

Technology of the selective gold plating for PGA370 and RP54 high density ceramic packages which constructed with the separated metallic conductors and leads has been developed. The results show that the selective gold plating of the above mentioned packages could be implemented successfully with the combination of the fractional electroless and electroplating under suitably controlled plating conditions.