摘要
介绍了电子束焊接加工技术的特征 ,总结了电子束焊接接头中存在的强度非匹配效应及其对断裂行为的影响。同时引入了与EBW相类似焊接的接头质量评定方法———宽板试验 。
The paper introduced electron bean welding (EBW) and its characteristics, concluded strength mismatch in electron bean welded joints and its influence on fracture behavior. At the same time, wide plate test -a test used for the joint quality assessment of the welding similar to EBW was introduced. The several suggestions for electron beam welding quality assessment were also provided.
出处
《焊接》
2001年第11期21-23,共3页
Welding & Joining