多层片式电感器介质材料及其工艺的发展现状

Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors

综述了近年来国内外多层片式电感器介质材料及其工艺研究的发展现状和方向，介绍了不同的频率段，应选择不同的低烧材料作为器件的介质材料，特别针对有关用于高频ＭＬＣＩｓ的低介瓷的研究进行了详细的介绍．同时概括了多层片式电感器生产的特殊而典型工艺过程．

Recently overseas and domestic general situation and developing tendence about dielectric materials and the processings for MLCIs were reviewed. Different low-temperature sintering materials should be selected for MLCIs in different frequency ranges. The research on the low dielectric constants materials for high frequency MLCIs particularly was introduced. While the specially and typically producing processings of MLCIs were summarized.