微电子塑封成型过程的数值模拟技术

Numerical Simulation of the Moulding Process of the Micro-electronics Plastic Sealing

对微电子塑封充填过程的数值模拟技术进行了分析和研究 ,介绍了根据塑封充填阶段的反应特性及塑封模具的几何特点建立的材料行为模型和几何模型 。

The numerical simulation of the filling course of the plastic sealing for micro_electronics was analyzed and studied. The material action model and geometrical model set up according to the reaction property of the plastic sealing in the filling course and to the geometrical characteristics of the plastic mould were introduced. The numerical analysis process of a typical plastic sealing product was stated in detail.