摘要
对微电子塑封充填过程的数值模拟技术进行了分析和研究 ,介绍了根据塑封充填阶段的反应特性及塑封模具的几何特点建立的材料行为模型和几何模型 。
The numerical simulation of the filling course of the plastic sealing for micro_electronics was analyzed and studied. The material action model and geometrical model set up according to the reaction property of the plastic sealing in the filling course and to the geometrical characteristics of the plastic mould were introduced. The numerical analysis process of a typical plastic sealing product was stated in detail.
出处
《模具工业》
北大核心
2001年第10期51-55,共5页
Die & Mould Industry
基金
河南省自然科学基金资助项目
关键词
微电子塑封
数值分析
充填模拟
集成电路
micro_electronics plastic sealing
numerical analysis
filling simulation