三维反卷积显微成像技术浅谈

Three-dimensional Wide-field Deconvolution Imaging Microscopy

三维宽场反卷积显微成像技术是应用光学切片方法获取三维标本的二维图像序列 ,然后通过反卷积图像处理方法进行图像恢复 ,进而进行三维重建的一种以光学技术和图像处理技术为核心的显微成像方法。本文讲述了光学切片的基本原理 ,给出了反卷积处理中点扩展函数的理论模型和实验测试方法 ,然后对现存的反卷积算法做了对比。最后 ,文章对这一领域的发展趋势作了预测。

Three-dimensional deconvolution microscopy is a newly developing technology for imaging three-dimensional image of a living specimen.This article focuses in two aspects of the technology.One is optical sectioning microscopy,and the other is deconvolution algrithm.We,firstly,relate the basic principle of the optical sectioning microscopy.And then we discuss the PSF model,its experimentally acquirimg method using in the deconvolution algorithm and the existing deconvolution algorithm.Finally we delineate the hardware and software components of the deconvolution microscopy and make some predictions in this field.