带锥敏感薄膜形变特性有限元仿真

FEM-simulation of deformation characteristics of pyramids-coupled sensing film

在一种新的基于真空二极管原理的场发射压力传感器中 ,阴极发射尖锥体和敏感薄膜制备于同一硅片上 ,从而简化了传感器的封装工艺 ,但因此可能导致传感器灵敏度的减小。利用有限元仿真技术 ,计算了在外部压力作用下 ,几何形状比较复杂的带尖锥体敏感薄膜的横向挠度形变特性。计算结果表明 ,与不带尖锥体的敏感薄膜相比较 ,带尖锥体敏感薄膜在额定外部静压力作用下的最大横向挠度的减小量小于 0 .4% 。

In a new structure of field emission pressure sensor,the cathode emitter array is produced on a sensible film, which makes the alignment and bond between anode and cathode simple. But it may decrease the sensitivity of the sensor due to the pyramids (cathode emitter array) on the sensible film. The deformation characteristics of the sensible film coupled with the pyramids are analyzed by FEM simulation. It is concluded that the reduction of the sensor sensitivity, which is caused by the pyramids on the sensible film, is negligible.