摘要
讨论了#1和#2两种超细金粉在电子浆料中的应用。#1超细金粉用于印刷型金导体浆料中，线分辨率高，性能稳定。#2超细金粉应用于焊接型金导体浆料，满足欧姆接触和附着力的要求。
The applications of #1和#2 super-fine powdered gold on electronic paste are discussed. #1 is designed for printing conductors and #2 for welding. With #1 powder, the conductor line resolution goes higher; and with #2, ohm contact and adhesion meet the requirements.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2001年第4期16-17,共2页
Electronic Components And Materials
关键词
超细金粉
焊接金浆
金导体浆料
电子浆料
super-fine powdered gold
gold paste for welding
gold paste for conductor
