摘要
根据薄板弹性力学 ,推导了室温键合过程中硅片接触表面缝隙封闭的临界条件 .硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素 .
A criterion of the gap closing between contact surfaces is studied according to elastic mechanics of thin plate.The important factors influencing the gaps closing include the gap height,the spatial wavelength,the specific surface energy of adhesion,the material deformability and the silicon wafer thickness.It is easier for the thin silicon wafers bonding than for the thick one.
基金
国家自然科学基金(批准号 :69990 5 40及 698962 60 -0 6)
科技部973(合同号 :G2 0 0 0 0 3 66)资助项目~~
关键词
室温键合界面缝隙
粗糙度
硅片
平整度
gaps between contact surfaces,roughness,the elastic deformation of thin plate
