摘要
综述了 2 1世纪陶瓷—金属封接技术的展望 ,着重叙述了电子器件用高热导率材料 ,真空开关管的技术发展对该技术的需求 。
In this paper,the prospects of ceramic to metal seal technology in 21th century are overviewed.High thermal conductivity materials used in electronic devices,specifications for vacuum interrupters as well as production technology and quality guqrantee are mentioned in focal point.
出处
《真空电子技术》
2001年第6期11-16,共6页
Vacuum Electronics
关键词
陶瓷-金属封接
高热导率材料
真空开关管
Ceramic to metal seal
High thermal conductivity material
Vacuum interrupter
