摘要
导电胶作为无铅连接材料的一种,近年来在电子封装中得到越来越多的重视。导电机理、组成及老化性能的研究成为导电胶实用化的关键因素。各向异性导电胶是连接用Pb/Sn合金的理想替代材料。
As one type of lead-free interconnect materials, ECA(Electrically Conductive Adhesives)has become an important area of research within the last few years. Conductive mechanism, components, and aging properties are key elements for the using of ECA. ACAs are ideal replacements of Pb/Sn interconnected materials.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2002年第1期1-3,7,共4页
Electronic Components And Materials
基金
清华大学核能技术设计研究院基础研究基金项目(985-04-301-3)
