化学镀镍内应力的研究

The Study on Internal Stress of Electroless Nikel Plating

用于非金属电镀、电铸、化学镀、化学铸的现行许多化学镀镍工艺 ,总是在零件尖端部位发生崩裂 ,在镜面光洁的地方易起泡 ,这种难题至今未得到很好解决 ,这大大限制了化学镀镍的应用。针对这种情况 ,采用正交实验方法开发出一个低温、低内应力化学镀镍工艺 ,初步探讨了沉积层内应力与各工艺参数之间的关系 ,以及作为添加剂的糖精在化学沉积层中的作用机理 ,并对内应力和结合力的关系作了简介。

The nickel phosphorus alloy coating often blisters on smooth surface and crazes or peels on pointed end of substrate when many existing electroless nickel plating technologies are applied to electroplating, electroforming, electroless plating,electroless forming on nonmetallic materials. This unsolved problem greatly limits the use of electroless plating. A new type of electroless nickel plating technology is developed by orthogonal test. Nickel phosphorus alloy coating with low internal stress can be obtained under low temperature .The relation between internal stress of the deposit and the technological factors is discussed. The function mechanism of saccharin as additive in electroless nickel plating is also referred. The results of the experiment show that this electroless nickel plating technology can be used to obtain a satisfied electroless nickel coating on irregular nonconducting materials or nonmetallic materials with low surface roughness in short time.