摘要Motorola公司(位于阿里桑那州的Phoenix)的半导体事业部,最近完成了对其0.35 μ m RF BiCMOS工艺,包括硅锗:碳(SiGe:C)技术,以及一些集成化的RF无源元件模块的鉴定.设计人员采用这种工艺技术,可以设计出更具创意,并且功能更加丰富的无线电话手机,手机的电池使用寿命也会更长,当今的蜂窝通信产品的成本也可以进一步降低.
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