外加磁场对磁控溅射过程及薄膜物性的影响

Influence of applied magnetic field on the magnetron sputtering and physical characteristics of the dep osited films

通过在放电空间中引入垂直基片方向有梯度的磁场,使得利用普通的平面磁控溅射技术可以方便地制备磁性薄膜。与此同时,磁性薄膜的许多物理性能发生了变化。这种变化还出现于非磁性靶的情况中。本工作对有、无磁场时溅射的过程与结果作了比较,包括自偏压值,薄膜结晶状况,薄膜磁性能的变化等等。通过比较认为,带电粒子在放电空间中的特殊磁场位形中的运动是变化的根本原因。

Gradient magnetic filed was introd uced into the discharge space in sput tering procedure.By such arrangement,it became easier t o sputter magnetic target(Fe)that led to the deposition of mag -netic films.Meanwhile,some properties of the magnetic film change were compared with the case without applied magnetic field.Such variations also appeared in sputte ring non -magnetic targets,such as Al and Cu.Comparison was made betw een some parameters for the case empl oying magnetic field and for the case without the target,i ncluding the variations of self -bia s voltage,of the crystallization and the magnetic properties of the films.The distribution gradient of ma gnetic field in the discharge space is considered as the radical re ason of such variations mentioned ab ove.