摘要
本文提出一种新型的圆柱旋转双面矩形磁控溅射靶 ,它具有平面磁控溅射靶的优点。根据靶的结构与工作原理 ,给出了圆柱双面矩形磁控靶磁场强度计算数学模型及计算公式。依据该计算方法 ,对具体的靶进行了计算机编程计算 ,并根据计算结果绘制出了靶磁场分布曲线。计算结果表明 :圆柱双面矩形磁控靶的磁场分布比较均匀 ,磁场强度满足磁控溅射功能的需要 ,其靶的溅射刻蚀区可宽达 4 0°角的范围。从而提高了膜层的沉积速率及膜层沉积范围 ,改善了同轴圆柱形磁控靶由于环状磁场所引起的膜层不够均匀及靶材利用率低的问题 ,可以在靶磁场两侧的大面积平面基片上沉积出膜厚均匀的涂层。
A new rotary column double magnetron sputtering target is introduced.It has the advantage of the planar magnetron sputtering target.On the basis of its structure and operation principle,a kind of the math model and the calculating formula of the magnetic field strength of the target is presented.By the method,the calculation about the concrete target using the computer program has been finished and the distributied curve of the magnetic field of the target has been drawn too.The calculating results are given,the magnetic field of the rotary column double magnetron sputtering target is comparative even and the intensity can satisfy the need of the magnetron sputtering functions.The target etching angle is nearly 40°,so that the deposition rate is increased and the coating area is enhanced obviously.The homogeneity of the deposited films and the lifetime of the target,which are the general troubles with conventional cylinder magnetron sputtering target,have been greatly improved.A large area of homogeneous films can be deposited by the sides of the target.
出处
《真空与低温》
2001年第4期233-237,共5页
Vacuum and Cryogenics
