钨渗铜材料在真空高压开关上的应用

Applications of Tungsten Material with Copper Infiltration to Vacuum High Voltage Switch

为适应高压真空开关抗熔焊、耐电蚀、高电导、低含气量等要求 ,对传统的生产工艺作了一系列改进 ,采用纯钨粉经模压成型、高温烧结 ,然后一次完成渗铜和覆铜。结果表明 ,钨骨架强度高 ,钢呈网状分布 ,基体组织细小均匀 ,气体含量低 ,覆铜层与钨铜基体结合紧密 ,从而满足了使用要求 ,降低了成本 ,获得了较好的经济效益。

To meet the needs of high voltage vacuum switch, such as melt welding resistance, arc erosion resistance, high conductivity, low gas content etc, a series of improvement has been made on traditional production process.In this work,pure tungsten powder compacts in steel mold,then sinters at high temperature,and at last it is infiltrated and covered with copper together.This would result in high tungsten skeleton strength,net distributed copper,fine and uniform matrix structure ,low gas content,and compact adhesion between the covered copper and matrix. The products can meet the demands of use with reduced cost of production.