摘要
应用超单元技术并结合局部 /整体三维有限元模型 ,以 Flip Chip封装体系为例 ,对 FlipChip焊点的振动疲劳可靠性问题进行研究 .基于三带技术和高周疲劳关系式 ,提出了 Flip Chip典型焊点的随机振动环境中的振动疲劳寿命预测模型 ,并把预测得到的振动疲劳寿命和热疲劳寿命进行比较 ,证实了振动疲劳对 Flip Chip焊点寿命影响的重要性 .利用应力 /应变分析结果 。
An advanced global/local finite element modeling (FEM) technique combined with superelement technique was used to study SMT solder joint vibration fatigue on the basis of an example of Flip Chip assembly. Flip Chip solder joint vibration fatigue life prediction model was developed on the basis of three-band technique and high-cycle fatigue equation. It is verified that vibration fatigue has an important effect on the Flip Chip solder joint life by comparing thermal fatigue life with vibration fatigue life. Meanwhile, solder joint crack propagation area was determined by means of stress/strain analysis results.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2001年第12期1855-1855,共1页
Journal of Shanghai Jiaotong University
