片状镀银铜粉的制备及性能研究

Preparation of Flake Plated Silver Copper Powder and Its Characteristic Research

采用三种制备方法制备片状镀银铜粉，并对其性能进行比较，结果表明：（１）不同制备方法银在片状铜粉上的表面形貌不同，采用化学镀银后再球磨，能得到导电性好的片状镀银铜粉；（２）无水乙醇洗涤、室温真空干燥的片状镀银铜粉，其比重、松比及导电性能较好；（３）离子水洗涤，真空干燥温度为４０℃时，得到导电性较好的片状镀银铜粉．

This paper presents 3 methods by which copper powder plated with silver is made. The properties of the copper powder made by different methods are compared. The results show that the surface morphologies of silver in the flake copper powder are different with different methods. The copper powder plated with silver with good electric conductivity can be obtained by means of wet mill after plated with silver, the specific grav-ity, loose specific gravity and electric conductivity of the copper powder plated with silver with absolute alco-hol washing and room temperature vaccum drying are very good; The electric conductivity of the copper pow-der plated with silver copper powder is better if washed with ion water and by vaccum drying at 40C.