摘要
本文以 LSI 的焊接技术为背景,探讨了焊接的要求,从微细接合技术,高速、高稳定接合技术和耐热可靠性的提高等三个观点,阐述了其现状和将来。
The requirements of welding process are studied with LSI bondingtechnique taken as an example.The present status and the developmenttrend of LSI bonding technique are expounded in view of fine bonding tech-nique, high speed and high stability bonding technique as well as the en-hancement of thermal stability of the weldment.
关键词
热压球焊
接合强度
Fine bonding technique
Bonding strength
Intermediate phase
