摘要
本文采用粉末冶金法对 W/ Cu和 Mo/ Cu材料进行了系统研究。结果表明 ,W/ Cu和 Mo/ Cu材料的制备工艺、组织结构类似 ,前者的硬度、密度和热导率较后者的高 ;而后者的电导率高于前者。故不同的应用场合应选择不同的复合材料。
The materials of W/Cu and Mo/Cu were systematically investigated in this paper by the method of powder metallurgy.The results show that manufacturing processes and microstructures of W/Cu and Mo/Cu materials are similer.The hardness, density and thermal conductivity of the formar are higher than that of the later,but the electric conductivity of the later is higher than that of the formar.So we should chose different composites for different applications
出处
《电工材料》
CAS
2001年第4期3-6,共4页
Electrical Engineering Materials
关键词
电触头材料
硬度
密度
电导率
热导率
钨/铜复合材料
钼/铜复合材料
W/Cu,Mo/Cu composites
electric contact material
hardness
density
electric conductivity
thermal conductivity
