摘要
塑封模是集成电路生产中不可缺少的工艺装备 ,塑封模设计过程中温度补偿直接关系到塑封模具制造的成败 ,也是塑封模CAD系统必须要考虑的因素。在推导出塑封模温度补偿系数计算公式的基础上 ,开发出塑封模CAD系统中温度补偿程序 ,并且介绍了程序的使用方法。
Packaging mould is a very important tool in IC (integration circuit) production. The temperature compensation concerns directly the success of packaging mould and must to be considered in packaging mould CAD system. The paper deduces the formulation of temperature compensation, develops the program of temperature compensation and introduces how to use.
出处
《模具技术》
2002年第1期50-52,58,共4页
Die and Mould Technology
关键词
塑封模具
集成电路
温度补偿
CAD
packaging mould
integration circuit
temperature compensation
CAD
