自组装膜吸附钯的化学镀前活化研究

Study on a New Activation Method for Initiating Electroless Plating on Alumina Powders Based on SAMs Bonded Palladium

提出了一种无需氯化亚锡敏化、基于分子自组装膜(SAMs)吸附钯的活化方法,成功地引发了在氧化铝粉末表面的化学镀铜.用XPS、AES、FTIR研究了钯的吸附机理,认为是由于氯化钯与SAMs上向外突出的氨基形成了化学键,并提出了相应的活化机理.金属化产物经XRD、FTIR、剖面金相显微表征分析与压片电阻率测定,示为金属铜完全包覆氧化铝的复合材料.该活化工艺具有活性引发层厚度薄、寿命长和与基底结合力强等优点,也可应用于其它表面富羟基的基底材料.

Electroless plating on non metallic species requires the surface to be metallized.Typically the catalytic palladium nuclei are adsorbed on the particles via stannous chloride sensitization.In this paper,a new activation method has been developed for initiating electroless copper plating on alumina powder based on palladium chemisorption on SAMs of 3 Aminopropyltriethoxysilane (APTS) in the absence of SnCl2 sensitization.XPS study indicates that chemsorption of palladium on the surfaces was achieved by bonding palladium chloride to the outwards pendant amino group of the SAMs.Therefore,the palladium is not easily to be desorpted.The metallized product was characterized by XRD,FTIR and cross section metallography.The results showed that alumina was covered by a uniform fcc structured crystalline copper layer about 2 μm thick.This concerned activation method has the advantages of decreasing the thickness of the activation layer,improving the storage life of the activated powders and enhancing adhesion between the deposited metal and the substrate without roughening conditioning.It could also be extended to other substrates with hydroxylated surfaces.