摘要
为改善固化物的脆性 ,用低分子聚酰胺PA - 6 5 0作固化增韧剂 ,选择改性苯二甲胺A - 5 0作固化剂、咪唑改性物作促进剂 ,开展低温固化环氧树脂胶粘剂的研究。运用计算机辅助二元二次回归正交设计的方法 ,经 9组实验和数据处理 ,得到树脂性能与组分配比的回归方程 ,绘制性能—配比的立体曲面图 。
In this paper,using a low molecular weight polyamide resin PA-650 as toughening agent and co curing agent to improve the brittleness of epoxy resin adhesive,using a modified xylenediamine A-50 as curing agent and a modified imidazole as accelerating agent,we have conducted a study on low temperature curable adhesive.Experimental optimization for resin adhesive formulations utilized a computer aided quadratic regression orthogonal combination design which gave good regression equations from 9 groups of experiments.Variance analysis showed that the regression equations are accurate enough for predicting properties of resins.Three dimensional curved surfaces were put up,which visually demonstrate the relationship between the formulations and properties of the resins.According to these,we have developed a low temperature curable epoxy resin adhesive with good properties.
出处
《粘接》
CAS
2002年第1期12-15,共4页
Adhesion
