摘要
介绍了国内外磺酸型 Sn- Pb合金电镀添加剂近十年的研究历程现况并根据各组分的化学结构及其在电镀中所体现出的性质将添加剂分为 Sn2 + 离子稳定剂、光亮剂及分散剂三类。最后列出了新研制的甲烷磺酸 Sn-
Research status of additives in sulfonic acid tin lead electroplating in recent ten years at home and abroad is introduced. The additives are classified as Sn 2+ stabilizer, brightener and carrier three kinds according to their chemical structure and to the performance they exhibited in electroplating. Main performances of the additives for methanesulfornic acid Sn Pb alloy electroplating developed recently by the company and the technological formulation of the methane sulfonic acid Sn Pb electroplating bath are presented.
出处
《电镀与精饰》
CAS
2002年第2期13-14,27,共3页
Plating & Finishing
