硅尖阵列-敏感薄膜复合型阴极真空微电子压力传感器特性的测试

Testing for the Characteristic of Vacuum Microelectronic Silicon Tip Array-sensitive Thin Film Compounded Cathode Pressure Sensor

封装、测试了硅尖阵列 -敏感薄膜复合型阴极的真空微电子压力传感器 ,在计算机模拟计算的基础上 ,对封装好的真空微电子压力传感器进行了实物测试 ,得出实物测试场发射电流曲线 (开启电压低 ,发射电流曲线与计算机模拟曲线一样 ,电压 45V时发射电流可达到86mA ,平均每个硅尖为 2 1 μA)、压力特性曲线 (呈线性变化 ,与计算机模拟计算的曲线相近 )及灵敏度数据。电压 1 .5V即可测试并且其压力特性成线性变化 ,灵敏度为 0 .3 μA/kPa。

The package and testing of a vacuum microelectronic silicon tip array-sensitive thin film compounded cathode pressure sensor are reported. Based on the simulative calculations, a testing of a packaged vacuum microelectronic pressure sensor is accomplished. Both the curves of the pressure(varing by linearity and is resemble with the simulation, emitting current reaches to 86mA when the voltage is 45V, each tip on average is 21μA) and the field induced current (unlock voltage is 1.5V, is congruous with the simulation) and the data of the sensitivity(0.3μA/kPa ) are required.