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我国半导体硅材料的发展现状 被引量：6

Development and state of chinese semiconductor Si material
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摘要 叙述了我国半导体硅材料的发展现状及与国外相比存在的差距 。 In this paper the development and the state of semicoductor Si material in China and the gap between chinese and international advanced level are reviewed.The suggestions in developing our nation's semiconductor Si material are given.
作者 蒋荣华 肖顺珍
机构地区 峨眉半导体材料厂
出处 《半导体情报》 2001年第6期31-35,共5页 Semiconductor Information
关键词 半导体硅 多晶硅 单晶硅 半导体材料 semiconductor Si polycrystal Si monocrystal Si CZ S FZ Si Silicon wafer
分类号 TN304.12 [电子电信—物理电子学]
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同被引文献41

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  • 2Ho K H,Newman S T,Rahimifard S,et al.State of the art in wire electrical discharge machining[J].International Journal of Machine Tools & Manufacture,2004,44:1247-1259.
  • 3Reynaerts D,Heeren P H,Brussels H V.Microstructuring of silicon by electro-discharge machining (EDM) part I:theory[J].Sensors and Actuators,1997,60:212-218.
  • 4Heeren P H,Reynaerts D,Brussels H V.Microstructuring of silicon by electro-discharge machining (EDM) part II:applications[J].Sensors and Actuators,1997,61:379-386.
  • 5Kozak J,Rajurkar K P,Chandarana N.Machining of low electrical conductive materials by wire electrical discharge maching (WEDM)[J].Journal of Materials Processing Tech.,2004,149(1-3):266-271.
  • 6Miller S F,Kao C C,Shih A J,et al.Investigation of wire electrical discharge machining of thin cross-sections and compliant mechanisms[J].International Journal of Machine Tools and Manufacture,2005,45(15):1717-1725.
  • 7Luis C J,Puertas I,Villa G.Material removal rate and electrode wear study on the EDM of silicon carbide[J].Journal of Materials Processing Tech.,2005,164:889-896.
  • 8Peng W Y,Liao Y S.Study of electrical discharge machining technology for slicing silicon ingots[J].Journal of Materials Processing Technology,2003,140(1-3):274-279.
  • 9Kozak J,Rajurkar K P,Chandarana N.Machining of Low Electrical Conductive Materials by Wire Electrical Discharge Maching(WEDM)[J].Journal of Materials Processing Tech.,2004,149(1-3):266-271.
  • 10Miller S F,Kan C C,Shih A J,et al.Investigation of Wire Electrical Discharge Machining of Thin Cross-sections and Compliant Mechanisms[J].International Journal of Machine Tools and Manufacture,2005,45(15):1717-1725.

引证文献6

二级引证文献7

半导体情报
2001年 第6期

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