摘要
电子产品日趋小型化、轻量化、多功能化 ,使电路板线路密度增加 ,从而对电路板的制作技术有了更高的要求 ,普通的接触曝光成像技术不能满足高密度电路的要求 ,激光直接成像(LDI)技术正迎合了精细线路的要求 ,而在PCB制作中得到应用。介绍了LDI的成像原理。
The increasing demands for miniaturization and greater functionality of electronic components and devices have a significant effect on the requirements of the PCB industry.As the conventional contact imaging is unsatisfied to the demands of high density patterns,the laser direct imaging (LDI) technology is good for the fine lines.Introduce the imaging principle of LDI,advantages and disadvantages of LDI and its application in PCB manufacturing.
出处
《电子工艺技术》
2002年第2期63-65,共3页
Electronics Process Technology
