摘要
随着微电子组装技术的发展 ,研制新型的和实用的无铅焊料替代传统的Sn -Pb焊料已成为近年来的研究热点。介绍了目前最常见的Sn -Ag、Sn -Zn和Sn -Bi为基体的无铅焊料并与传统的Sn
With the development of microelectronics assembly technology,the development of new and practical lead free solders replacing traditioonal Sn-Pb solder has been become the focus of study recently.Introduce current developed lead free solders based on Sn-Ag,Sn-Zn and Sn-Bi,and compared to traditional Sn-Pb solder.
出处
《电子工艺技术》
2002年第2期75-76,共2页
Electronics Process Technology
