期刊文献+

PCB成像技术综述

Shedding Light on PCB Imaging
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摘要 前言 图象转移是PCB生产过程中的关键步骤.随着HDI板和微导通孔板的生产实践以及普通印制板生产技术的提高,传统的接触成像已不能满足高水平的技术要求,而且传统的曝光设备也已经不能满足生产中对照相底版、连接盘、导通孔、定位精确度、图形重合度的要求.
出处 《印制电路信息》 2002年第2期38-41,共4页 Printed Circuit Information
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参考文献5

  • 1TheInterconnection Technology ResearchInstitute,"A White Paper on Domestic PWB Technology Hurdles and Barriers,and a Strategy to Overcome Those Barriers," October 1999
  • 2Jain,K., "Large-Area,High-Throughput,High-Resolution,Projection Imaging System,"U.S.Patent no.5285236,issued Feb.8,1994
  • 3Jain,K., "High-Throughput,HighResolution,Projection Patterning System for Large,Flexible,Roll-Fed Electronic-Module Substrates," U.S.Patent no.5652645,issued Jul.29,1997
  • 4Jain,K., "Large-Area,High-Throughput,HighResolution Lithography Systems for Flat-Panel Displays and Microelectronic Modules," SPIE Proceedings,vol.3631,p. 197,April 1999
  • 5Vaucher, C.,"The Paradox of Direct Imaging,"CircuiTree,p. 120,March 2000

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