摘要
简述了国内外切割设备的最高水平和发展趋势 ,比较了国内与国外切割设备的差距及我国切割设备发展中存在的问题 ,提出了面对WTO发展我国切割设备应采取的措施和对策。
Describing the abroad and domestic highest technical level and developing trend of the wafer slicing equipment,comparing the domestic wafer slicing equipment with that of abroad and nothing the existing problem in developing national wafer slicing equipment,proposing the measures we should take facing WTO.
出处
《电子工业专用设备》
2001年第2期11-13,44,共4页
Equipment for Electronic Products Manufacturing
