摘要
本文介绍了非光敏聚酰亚胺用于双极型高压晶体管芯片制造阶段的表面钝化的工艺。该工艺的应用使晶体管生产成本有了大幅度的下降。
Surface passivation with non photosensitive polyimide to replace photosensitive polyimide is introduced in the paper,as a result of the process applied,the cost of production of transistors has been remarkably decreased.
出处
《微电子技术》
2001年第5期49-51,共3页
Microelectronic Technology
关键词
非光敏聚酰亚胺
表面钝化腐蚀
双极晶体管
Non photosensitive polyimide
Photosensitive polyimide
Surface passivation
Etching
Imide
